Search

Record Citations

APA Citation

Li, J. (2011). Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages. Aalto University.

Chicago Style Citation

Li, Jue. Numerical Simulations for Reliability Assessment of Lead-free Solder Interconnections in BGA Packages. [Espoo]: Aalto University, 2011.

MLA Citation

Li, Jue. Numerical Simulations for Reliability Assessment of Lead-free Solder Interconnections in BGA Packages. Aalto University, 2011.

Harvard Style Citation

Li, J. 2011. Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages. [Espoo]: Aalto University.

Remember to check citations for accuracy before including them in your work.
Kysy apua / Ask for help

Content Cannot be Displayed

Chat content cannot be displayed due to cookie settings. To view the content, modify your cookie settings to allow the following categories: Chat Services.

Cookie Settings