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Cookie SettingsLi, J. (2011). Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages. Aalto University.
Chicago Style CitationLi, Jue. Numerical Simulations for Reliability Assessment of Lead-free Solder Interconnections in BGA Packages. [Espoo]: Aalto University, 2011.
MLA CitationLi, Jue. Numerical Simulations for Reliability Assessment of Lead-free Solder Interconnections in BGA Packages. Aalto University, 2011.
Harvard Style CitationLi, J. 2011. Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages. [Espoo]: Aalto University.
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