International Conference on Tangible, Embedded and Embodied Interaction, Association for Computing Machinery, author, issuing body, Han'guk Kwahak Kisurwŏn, host intitution, & SIGCHI (Group : U.S.), sponsoring body. (2022). TEI'22: Proceedings of the Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction : 13-16 February 2022. Association for Computing Machinery.
Chicago Style CitationInternational Conference on Tangible, Embedded and Embodied Interaction, author Association for Computing Machinery, host intitution Han'guk Kwahak Kisurwŏn, and sponsoring body SIGCHI (Group : U.S.). TEI'22: Proceedings of the Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction : 13-16 February 2022. New York: Association for Computing Machinery, 2022.
MLA CitationInternational Conference on Tangible, Embedded and Embodied Interaction, et al. TEI'22: Proceedings of the Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction : 13-16 February 2022. Association for Computing Machinery, 2022.
Harvard Style CitationInternational Conference on Tangible, E. a. E. I., Association for Computing Machinery, a., Han'guk Kwahak Kisurwŏn, h. i. & SIGCHI (Group : U.S.), s. b. 2022. TEI'22: Proceedings of the Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction : 13-16 February 2022. New York: Association for Computing Machinery.
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