Abstract

A 3D multilayer structure built by two ultra‐low temperature co‐fired ceramic (ULTCC) compositions with silver embedded electrodes are co‐fired at a temperature of 450°C. The 3D multilayer module is prepared by laminating the ULTCC green tapes with a new binder system, which organics can be completely burned out at temperature of 250°C before the sintering of the ULTCC 3D modulus. High‐density microstructures are achieved for the sintered module. In this study, the ULTCC feasible binder system is introduced. Also, ULTCC multilayers and multimaterial structures with surface and embedded silver electrodes are fabricated. This research opens up a new horizon for fabrication of electroceramic devices with embedded electrodes in multimaterial devices.